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52 Week Range
Liquidity
Market cap
$576 Mln
P/E Ratio
13.28
P/B Ratio
0.74
Industry P/E
--
Debt to Equity
0.6
ROE
0.06 %
ROCE
3.51 %
Div. Yield
6.83 %
Book Value
33.95
EPS
1.92
CFO
$52,398.29 Mln
EBITDA
$64,904.06 Mln
Net Profit
$26,693.63 Mln
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ChipMOS TECHNOLOGIES - ADR
| -16.41 | -14.08 | -13.42 | -45.31 | -21.56 | -3.89 | -3.51 |
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BSE Sensex
| 0.39 | 6.40 | 1.96 | 7.69 | 10.43 | 20.75 | 10.61 |
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2024
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2023
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2022
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2021
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2020
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2019
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2018
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ChipMOS TECHNOLOGIES - ADR
| -30.59 | 26.97 | -39.00 | 49.82 | 13.76 | 40.13 | 3.56 |
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BSE Sensex
| 8.10 | 18.74 | 4.44 | 21.99 | 15.75 | 14.38 | 5.87 |
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BSE Sensex
| 8.10 | 18.74 | 4.44 | 21.99 | 15.75 | 14.38 | 5.87 |
Is there a threat to the company's solvency?
Can creative accounting be detected through the financial numbers?
How did the company perform in the last one year?
3Y Avg -- 5Y Avg -- TTM --
P/E Ratio
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--Min --Median --Max
P/B Ratio
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Earnings Yield (%)
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Earnings Yield (%) = EBIT / Enterprise value
PEG Ratio
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Price = Price / Earnings to growth ratio
Company |
Price ($) | Market Cap ($ Mln) | P/E Ratio | ROE |
|---|---|---|---|---|
| 58.96 | 9,532.16 | -- | -14.87 | |
| 41.18 | 5,723.37 | 94.52 | 8.71 | |
| 97.29 | 7,228.06 | -- | -9.25 | |
| 55.98 | 8,578.70 | 17.19 | 8.27 |
ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People's Republic of China, Singapore, and internationally. The... company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan. Address: No.1, Yanfa 1st Road, Hsinchu City, Taiwan Read more
Chairman, CEO & President
Mr. Shih-Jye Cheng
Chairman, CEO & President
Mr. Shih-Jye Cheng
Headquarters
Hsinchu City
Website
Our rating system has guided millions of investors in the past 20 years.
The total asset value of ChipMOS TECHNOLOGIES INC - ADR stood at $ 45,380 Mln as on 31-Dec-24
The share price of ChipMOS TECHNOLOGIES INC - ADR is $15.74 (NASDAQ) as of 17-Apr-2025 16:00 EDT. ChipMOS TECHNOLOGIES INC - ADR has given a return of -21.56% in the last 3 years.
ChipMOS TECHNOLOGIES INC - ADR has a market capitalisation of $ 576 Mln as on 16-Apr-2025. As per Value Research classification, it is a company.
The P/E ratio of ChipMOS TECHNOLOGIES INC - ADR is 13.28 times as on 16-Apr-2025.
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ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan. Address: No.1, Yanfa 1st Road, Hsinchu City, Taiwan
The CEO & director of Mr. Shih-Jye Cheng. is ChipMOS TECHNOLOGIES INC - ADR, and CFO & Sr. VP is Mr. Shih-Jye Cheng.
There is no promoter pledging in ChipMOS TECHNOLOGIES INC - ADR.
Some of the close peers are:
| Company | Market Cap($ Mln) |
|---|---|
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1,043
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926
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792
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639
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| ChipMOS TECHNOLOGIES INC. - ADR | Ratios |
|---|---|
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Return on equity(%)
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5.7
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Operating margin(%)
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5.61
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Net Margin(%)
|
6.26
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Dividend yield(%)
|
--
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No, TTM profit after tax of ChipMOS TECHNOLOGIES INC - ADR was $0 Mln.
