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Today’s Range
52 Week Range
Liquidity
Market cap
$4,220 Mln
P/E Ratio
11.94
P/B Ratio
1.01
Industry P/E
--
Debt to Equity
0.31
ROE
0.09 %
ROCE
6.58 %
Div. Yield
1.95 %
Book Value
16.74
EPS
1.43
CFO
$8,026.89 Mln
EBITDA
$8,956.69 Mln
Net Profit
$2,967.60 Mln
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Amkor Technology (AMKR)
| -37.84 | -18.56 | -37.27 | -48.83 | -5.33 | 11.73 | 6.50 |
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BSE Sensex
| 0.39 | 6.40 | 1.96 | 7.69 | 10.43 | 20.75 | 10.61 |
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S&P Small-Cap 600#
| -5.82 | -5.34 | -13.73 | -6.30 | 5.30 | 2.98 | 5.53 |
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2024
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2023
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2022
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2021
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2020
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2019
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2018
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Amkor Technology (AMKR)
| -22.62 | 38.74 | -3.27 | 64.39 | 16.00 | 98.17 | -34.57 |
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S&P Small-Cap 600
| 7.01 | 13.89 | -17.42 | 25.27 | 9.57 | 20.86 | -9.70 |
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BSE Sensex
| 8.10 | 18.74 | 4.44 | 21.99 | 15.75 | 14.38 | 5.87 |
Is there a threat to the company's solvency?
Can creative accounting be detected through the financial numbers?
How did the company perform in the last one year?
3Y Avg -- 5Y Avg -- TTM --
P/E Ratio
--
--Min --Median --Max
P/B Ratio
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--Min --Median --Max
Earnings Yield (%)
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Earnings Yield (%) = EBIT / Enterprise value
PEG Ratio
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Price = Price / Earnings to growth ratio
Company |
Price ($) | Market Cap ($ Mln) | P/E Ratio | ROE |
|---|---|---|---|---|
| 44.78 | 1,517.97 | 7.67 | 21.41 | |
| 25.20 | 2,089.52 | 30.46 | 7.5 | |
| 29.10 | 1,626.59 | 277 | 0.34 | |
| 114.99 | 5,883.33 | 29.67 | 11.01 |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer... back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona. Address: 2045 East Innovation Circle, Tempe, AZ, United States, 85284 Read more
Executive Chairman of the Board
Mr. James J. Kim
Executive Chairman of the Board
Mr. James J. Kim
Headquarters
Tempe, AZ
Website
Our rating system has guided millions of investors in the past 20 years.
The total asset value of Amkor Technology Inc (AMKR) stood at $ 6,944 Mln as on 31-Dec-24
The share price of Amkor Technology Inc (AMKR) is $15.97 (NASDAQ) as of 17-Apr-2025 16:00 EDT. Amkor Technology Inc (AMKR) has given a return of -5.33% in the last 3 years.
Amkor Technology Inc (AMKR) has a market capitalisation of $ 4,220 Mln as on 16-Apr-2025. As per Value Research classification, it is a Small Cap company.
The P/E ratio of Amkor Technology Inc (AMKR) is 11.94 times as on 16-Apr-2025.
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Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona. Address: 2045 East Innovation Circle, Tempe, AZ, United States, 85284
The CEO & director of Mr. James J. Kim. is Amkor Technology Inc (AMKR), and CFO & Sr. VP is Mr. James J. Kim.
There is no promoter pledging in Amkor Technology Inc (AMKR).
Some of the close peers are:
| Company | Market Cap($ Mln) |
|---|---|
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657
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229
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171
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157
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| Amkor Technology Inc. (AMKR) | Ratios |
|---|---|
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Return on equity(%)
|
8.73
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Operating margin(%)
|
7.85
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Net Margin(%)
|
5.6
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Dividend yield(%)
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--
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No, TTM profit after tax of Amkor Technology Inc (AMKR) was $0 Mln.
$-0.18
(
